| 2022 | Gong, Yanpeng and Qin, Fei and Dong, Chunying and Trevelyan, Jon: An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources. In: Applied Mathematical Modelling, 109, 2022, 161--185 |
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| 2022 | Yu, Bo and Cao, Geyong and Ren, Shanhong and Gong, Yanpeng and Dong, Chunying: An isogeometric boundary element method for transient heat transfer problems in inhomogeneous materials and the non-iterative inversion of loads. In: Applied Thermal Engineering, 212, 2022, 118600 |
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| 2022 | An, Tong and Tian, Yanzhong and Qin, Fei and Dai, Yanwei and Gong, Yanpeng and Chen, Pei: Comparison of junction temperature variations of IGBT modules under DC and PWM power cycling test conditions. In: Journal of Power Electronics, 2022, 1--15 |
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| 2022 | Zhao, Shuai and Dai, Yanwei and Qin, Fei and Li, Yanning and An, Tong and Gong, Yanpeng: Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints. In: Engineering Fracture Mechanics, 264, 2022, 108355 |
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| 2022 | Qin, Fei and Zhao, Shuai and Dai, Yanwei and Liu, Lingyun and An, Tong and Chen, Pei and Gong, Yanpeng: Indentation tests for sintered silver in die-attach interconnection after thermal cycling. In: Journal of Electronic Packaging, 144, 2022, |
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| 2022 | Qin, Fei and Zhao, Shuai and Dai, Yanwei and Hu, Yuankun and An, Tong and Gong, Yanpeng: Mud-cracking effect of sintered silver layer on quantifying heat transfer behavior of SiC devices under power cycling: A Voronoi tessellation model. In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022, |
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| 2021 | Wang, Chao and Wang, Fajie and Gong, Yanpeng: Analysis of 2D heat conduction in nonlinear functionally graded materials using a local semi-analytical meshless method. In: Aims Math, 6, 2021, 12599--12618 |
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| 2021 | He, Qi and Gong, Yanpeng and Qin, Fei: Application of a FEM-BEM coupling method in steady-state heat transfer problem. In: Boundary Elements and other Mesh Reduction Methods XLIV, 131, 2021, 121 |
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| 2021 | Yu, Bo and Cao, Geyong and Gong, Yanpeng and Ren, Shanhong and Dong, Chunying: IG-DRBEM of three-dimensional transient heat conduction problems. In: Engineering Analysis with Boundary Elements, 128, 2021, 298--309 |
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| 2021 | Zhao, Shuai and Dai, Yanwei and Qin, Fei and Li, Yanning and Liu, Lingyun and Zan, Zhi and An, Tong and Chen, Pei and Gong, Yanpeng and Wang, Yuexing: On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters. In: Materials Science and Engineering: A, 823, 2021, 141729 |
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| 2021 | An, Tong and Li, Zezheng and Zhang, Yakun and Qin, Fei and Wang, Liang and Lin, Zhongkang and Tang, Xinling and Dai, Yanwei and Gong, Yanpeng and Chen, Pei: The effect of the surface roughness characteristics of the contact interface on the thermal contact resistance of the PP-IGBT Module. In: IEEE Transactions on Power Electronics, 37, 2021, 7286--7298 |
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| 2021 | Yu, Huiping and Guo, Yubo and Gong, Yanpeng and Qin, Fei: Thermal analysis of electronic packaging structure using isogeometric boundary element method. In: Engineering Analysis with Boundary Elements, 128, 2021, 195--202 |
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| 2021 | Qin, Fei and Zhao, Shuai and Liu, Lingyun and Dai, Yanwei and An, Tong and Chen, Pei and Gong, Yanpeng: Thickness and metallization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation. In: Microelectronics Reliability, 124, 2021, 114290 |
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| 2021 | Yu, Bo and Cao, Geyong and Meng, Zeng and Gong, Yanpeng and Dong, Chunying: Three-dimensional transient heat conduction problems in FGMs via IG-DRBEM. In: Computer Methods in Applied Mechanics and Engineering, 384, 2021, 113958 |
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| 2020 | Sun, FL and Gong, YP and Dong, CY: A novel fast direct solver for 3D elastic inclusion problems with the isogeometric boundary element method. In: Journal of Computational and Applied Mathematics, 377, 2020, 112904 |
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| 2020 | Qin, Fei and Hu, Yuankun and Dai, Yanwei and An, Tong and Chen, Pei and Gong, Yanpeng and Yu, Huiping: Crack effect on the equivalent thermal conductivity of porously sintered silver. In: Journal of Electronic Materials, 49, 2020, 5994--6008 |
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| 2020 | Gong, Yanpeng and Dong, Chunying and Qin, Fei and Hattori, Gabriel and Trevelyan, Jon: Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures. In: Computer Methods in Applied Mechanics and Engineering, 367, 2020, 113099 |
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| 2020 | Guo, Yubo and Yu, Huiping and Gong, Yanpeng and Qin, Fei: Thermal analysis of IGBT by isogeometric boundary element method. 2020 21st International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2020. 1--5 |
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| 2019 | Gong, YP and Yang, HS and Dong, CY: A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions. In: Computational Mechanics, 63, 2019, 181--199 |
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| 2019 | Sun, FL and Dong, CY and Wu, YH and Gong, YP: Fast direct isogeometric boundary element method for 3D potential problems based on HODLR matrix. In: Applied Mathematics and Computation, 359, 2019, 17--33 |
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| 2019 | Gong, Yanpeng and Trevelyan, Jon and Hattori, Gabriel and Dong, Chunying: Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures. In: Computer Methods in Applied Mechanics and Engineering, 346, 2019, 642--673 |
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| 2018 | Gong, Yanpeng and Hattori, Gabriel and Trevelyan, Jon and Dong, Chunying: A comparison of nearly singular integrals evaluation method for isogeometric boundary element method (IGABEM). 6th European Conference on Computational Mechanics (ECCM 6) & 7th European Conference on Computational Fluid Dynamics (ECFD 7). Glasgow, UK, 2018. |
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| 2018 | Gong, YP and Dong, CY and Qu, XY: An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity. In: Advances in Engineering Software, 119, 2018, 103--115 |
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| 2018 | Qu, XY and Dong, CY and Bai, Y and Gong, YP: Isogeometric boundary element method for calculating effective property of steady state thermal conduction in 2D heterogeneities with a homogeneous interphase. In: Journal of Computational and Applied Mathematics, 343, 2018, 124--138 |
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| 2017 | Gong, YP and Dong, CY: An isogeometric boundary element method using adaptive integral method for 3D potential problems. In: Journal of Computational and Applied Mathematics, 319, 2017, 141--158 |
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| 2017 | Gong, YP and Dong, CY and Bai, Y: Evaluation of nearly singular integrals in isogeometric boundary element method. In: Engineering Analysis with Boundary Elements, 75, 2017, 21--35 |
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| 2015 | Zhang, Yaoming and Gong, Yanpeng and Gao, Xiaowei: Calculation of 2D nearly singular integrals over high-order geometry elements using the sinh transformation. In: Engineering Analysis with Boundary Elements, 60, 2015, 144--153 |
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